Memory
Memory module producers have been shipping unbuffered DDR5 memory modules for desktop and laptop computers running Intel's 12th Generation Core 'Alder Lake' processors in high volumes since September, 2021, without any major issues. But DDR5 is just now entering the datacenter world, and according to a recent report, it looks like power management ICs (PMICs) for registered DIMMs have become a constraining factor due to compatibility issues. In a report published by TrendForce discussing the current state of the market for server-grade DDR5 memory, the semiconductor analyst firm noted that there is an issue with PMIC compatibility for DDR5 RDIMMs, with both DRAM suppliers and PMIC vendors are collaborating to resolve the problem. The analysts do not reveal the exact root cause of the problem...
GIGABYTE Enhances Aorus RGB Memory with Aorus Memory Boost Capability
One of the advantages of having a highly-integrated product stack is ability to fine tune performance of your devices when they work together. On the one hand, this allows...
6 by Anton Shilov on 11/1/2019GlobalFoundries Teams Up with Singapore University for ReRAM Project
GlobalFoundries has announced that the company has teamed up with Singapore’s Nanyang Technological University and the National Research Foundation to develop resistive random access memory (ReRAM). The next-generation memory...
6 by Anton Shilov on 10/28/2019Samsung Launches Single-Chip uMCP Packages with LPDDR4X DRAM & UFS 3.0 Storage
Samsung has introduced a new lineup of all-in-one memory packages for smartphones that integrate both DRAM and storage. The latest generation of uMCP devices now feature up to 12...
30 by Anton Shilov on 10/24/2019SK Hynix Develops 16 Gb DDR4 Chips for 32 GB Modules
SK Hynix announced on Monday that it has completed development of its first monolithic 16 Gb chip. This chip is to be made using its 3rd Generation 10 nm-class...
8 by Anton Shilov on 10/22/2019Team Group Quietly Launches 32 GB DDR4 Memory Modules
Team Group has quietly added 32 GB unbuffered DDR4 memory modules to its product catalogue and plans to start sales in the near future. The modules will feature JEDEC-standard...
8 by Anton Shilov on 10/22/2019Royal Memory: G.Skill’s 32 GB DDR4-4000 CL15 Kit for AMD & Intel
Bucking the trend of ever higher clocked DDR4 memory kits, G.Skill has introduced a new high-end memory kit that is focused on lower memory latencies. Compatible with both Intel...
14 by Anton Shilov on 10/21/2019Corsair 16GB DDR4-5000 Vengeance LPX Memory Kit: Built for AMD Ryzen 3000 and MSI
The high-tech industry loves milestones that are round numbers, be it frequency, number of cores, transistor count or something else. It is not that extra 100 MHz – 200...
38 by Anton Shilov on 10/11/2019G.Skill Launches 32 GB DDR4 Modules, 256 GB Kits: Up to DDR4-4000
G.Skill has now rolled out its 32 GB unbuffered DDR4 modules in dual-channel and quad-channel memory kits. The modules are offered with data transfer rates from 2666 MT/s to...
27 by Anton Shilov on 10/9/2019Samsung Develops 12-Layer 3D TSV DRAM: Up to 24 GB HBM2
Samsung on Monday said that it had developed the industry’s first 12-layer 3D packaging for DRAM products. The technology uses through silicon vias (TSVs) to create high-capacity HBM memory...
11 by Anton Shilov on 10/7/2019Gen-Z PHY Specification 1.1 Published: Adds PCIe 5.0, Gen-Z 50G Fabric
The Gen-Z Consortium this week released Physical Layer Specification 1.1 for Gen-Z interconnects. The new standard adds enhanced support for PCIe Gen 5 as well as Gen-Z 50G Fabric...
8 by Anton Shilov on 10/4/2019Micron: 128-Layer 4th 3D NAND with RG Architecture Coming Soon
Micron has taped out its first 4th Generation 3D NAND memory devices with its new replacement gate (RG) architecture. The tape out confirms that the company is on track...
10 by Anton Shilov on 10/4/2019Corsair Reveals Vengeance LPX DDR4-4866 Memory Kit
Corsair on Thursday released its fastest memory kit to date, the Vengeance LPX DDR4-4866, aimed at the most performance-hungry enthusiasts. The modules are specifically tested for compatibility AMD’s Ryzen...
12 by Anton Shilov on 9/13/2019YMTC Starts Volume Production of 64-Layer 3D NAND
Yangtze Memory Technologies Co. (YMTC) this week said that it had started volume production of its 64-layer 3D NAND memory that uses its proprietary Xtacking architecture. The bhips were...
4 by Anton Shilov on 9/5/2019Hot Chips 31 Analysis: In-Memory Processing by UPMEM
One of the key critical future elements about this world of compute is moving data about. Moving data requires power, to the point where calling data from memory can...
38 by Dr. Ian Cutress on 8/19/2019Micron’s Fab 10 Expansion Completed: 96-Layer 3D NAND Production Starts in 2019
Micron this week hosted a grand opening ceremony of its Fab 10 Expansion in Singapore. The new cleanroom is not expected to increase the company’s production capacity in terms...
21 by Anton Shilov on 8/16/2019Micron: Mass Production of 16 Gb DDR4 & LPDDR4X Chips Using 1z nm Technology
Micron announced on Thursday that it had started volume production of memory chips using its 3rd Generation 10 nm-class fabrication technology (also known as 1Z nm). The first DRAMs...
25 by Anton Shilov on 8/16/2019SMART Modular Shows Off 256 GB Gen-Z Memory Module
SMART Modular this month demonstrated one of the industry’s first prototypes of a EDSFF 3-inch DDR4 Gen-Z memory module. The ZMM supports advanced functionality enabled by the new interface...
15 by Anton Shilov on 8/15/2019SK Hynix Announces 3.6 Gbps HBM2E Memory For 2020: 1.8 TB/sec For Next-Gen Accelerators
SK Hynix this morning has thrown their hat into the ring as the second company to announce memory based on the HBM2E standard. While the company isn’t using any...
23 by Ryan Smith on 8/12/2019Japan’s Ministry Approves Shipments of Industrial Chemicals to South Korea
Amidst the ongoing trade conflict between Japan and South Korea, there is some good news to close the week out. The Japanese Ministry of Economy, Trade and Industry has...
16 by Anton Shilov on 8/9/2019Microchip Announces DRAM Controller For OpenCAPI Memory Interface
Microchip's subsidiary Microsemi is entering a new market with the introduction of the SMC 1000 8x25G Serial Memory Controller. This is a DDR4 DRAM controller that connects to host...
17 by Billy Tallis on 8/5/2019