Memory
Memory module producers have been shipping unbuffered DDR5 memory modules for desktop and laptop computers running Intel's 12th Generation Core 'Alder Lake' processors in high volumes since September, 2021, without any major issues. But DDR5 is just now entering the datacenter world, and according to a recent report, it looks like power management ICs (PMICs) for registered DIMMs have become a constraining factor due to compatibility issues. In a report published by TrendForce discussing the current state of the market for server-grade DDR5 memory, the semiconductor analyst firm noted that there is an issue with PMIC compatibility for DDR5 RDIMMs, with both DRAM suppliers and PMIC vendors are collaborating to resolve the problem. The analysts do not reveal the exact root cause of the problem...
GIGABYTE Launches Designare DDR4-3200 Memory, a 64 GB Kit
GIGABYTE is a relatively new player on the memory market, yet it clearly wants to participate in the premier league. As seen at CES, this week the company introduced...
23 by Anton Shilov on 2/6/2020
Micron Shipping LPDDR5 DRAM
Micron has announced their first LPDDR5 DRAM is in mass production and now shipping to customers. The new RAM is significantly faster and more power efficient than LPDDR4x. One...
33 by Billy Tallis on 2/6/2020
JEDEC Updates HBM2 Memory Standard To 3.2 Gbps; Samsung's Flashbolt Memory Nears Production
After a series of piecemeal announcements from different hardware vendors over the past year, the future of High Bandwidth Memory 2 (HBM2) is finally coming into focus. Continuing the...
24 by Ryan Smith on 2/3/2020
SK Hynix to Cut CapEx, Accelerate Transitions, 1z nm DRAM & 128L 4D NAND in 2020
Following a massive revenue and profitability drop in 2019, SK Hynix has announced that it plans to cut down its capital expenditures. While the market has shown some signs...
6 by Anton Shilov on 2/3/2020
Crucial’s 32 GB UDIMMs and SODIMMs Available: DDR4-2666 & DDR4-3200
In the summer of 2019, Crucial was among the first brands to demonstrate 32 GB unbuffered memory modules, which were based on Micron’s 16 Gb DDR4 chips. Now after...
12 by Anton Shilov on 1/29/2020
The Corsair DDR4-5000 Vengeance LPX Review: Super-Binned, Super Exclusive
The consumer memory industry has been teasing DDR4-5000 for a few months now. We saw one company show some DDR4-5000 modules at Computex back in July 2019, running...
56 by Gavin Bonshor on 1/27/2020
Here's Some DDR5-4800: Hands-On First Look at Next Gen DRAM
Just like all major makers of DRAM, SK Hynix produced its first DDR5 memory chips a couple of years ago and has been experimenting with the technology since then...
39 by Anton Shilov on 1/13/2020
CES 2020: Kingston’s HyperX Adds 32 GB UDIMMs & New Fury Speed Bins to Lineup
Kingston’s HyperX division introduced a stack of new memory modules at CES 2020. Firstly, the company added 32 GB unbuffered DIMMs and SO-DIMMs to its Fury and Impact families...
11 by Anton Shilov on 1/10/2020
DRAMeXchange: Blackout at Samsung’s Fab Will Not Affect Commodity DRAM Prices in Q1
Following a power outage and consequent disruption of production at Samsung’s Line 13 fab in Hwaseong, South Korea, back on December 31, 2019, there had been some concerns about...
5 by Anton Shilov on 1/9/2020
Fire At Kioxia & Western Digital NAND Fab - Impact on Supply to be Minimal
Kioxia has reportedly informed its customers that a production tool at one of its fabs caught fire early on Tuesday. The fire was promptly extinguished and no casualties were...
6 by Anton Shilov on 1/8/2020
CES 2020: Micron Begins to Sample DDR5 RDIMMs with Server Partners
Micron announced at CES that it had started sampling of its DDR5 Registered DIMMs with select partners. The very fact that Micron started sampling of DDR5 modules indicates that...
7 by Anton Shilov on 1/7/2020
Samsung’s Fab in Hwaseong Suffers Power Outage
Samsung had to stop production of DRAM and V-NAND memory at its fab near Hwaseong, South Korea, due to power outage earlier this week. Damage caused by disruption of...
48 by Anton Shilov on 1/2/2020
Kioxia: 3D Stacked Storage Class Memory, like 3D XPoint, Isn’t the Future
One of the key battlegrounds of the next decade is going to be storage: density, speed, and demand. Naturally all the major players in the space want to promote...
23 by Dr. Ian Cutress on 12/30/2019
Micron Obtains License to Sell DRAM & NAND to Huawei
The inclusion of Huawei into the U.S. Department of Commerce’s Entity List and consequent restrictions to work with the Chinese giant clearly made it much harder for the U.S.-based...
12 by Anton Shilov on 12/19/2019
ADATA Reveals XPG Hunter SO-DIMMs: Up to DDR4-3000, Up to 32 GB
ADATA has introduced its new family of SO-DIMMs for laptops and small form-factor desktops. The XPG Hunter DDR4 SO-DIMMs offer data transfer rates of up to 3000 MT/s and...
6 by Anton Shilov on 12/17/2019
Samsung to Expand 3D NAND Fab in China
Samsung reportedly plans to invest billions of dollars to expand its 3D NAND production facility in Xian, China. If the company proceeds with the plan, bit production capacity of...
5 by Anton Shilov on 12/17/2019
Team Group’s T-Force Xtreem ARGB Memory: Up to DDR4-4800, ‘Mirror Design’
With even "extreme" clockspeed DDR4 modules bordering on being commodity hardware these days, DRAM module manufacturers are increasingly using design as one of the primary ways to attract attention...
0 by Anton Shilov on 12/9/2019
ChangXin Memory Technologies (CXMT) is Ramping up Chinese DRAM Using Qimonda IP
ChangXin Memory Technologies (CXMT), previously known as Innotron, has started production of computer memory using a 19 nm manufacturing technology. The company has a roadmap for at least two...
15 by Anton Shilov on 12/2/2019
Spotted at Supercomputing 2019: A 256 GB Gen-Z Memory Module
As a millennial, everything in the media that ‘Gen Z’ does often gets lumped into the millennial category. Thankfully there’s another type of Gen-Z in the world: the cache...
11 by Dr. Ian Cutress on 11/29/2019
GlobalFoundries and SiFive to Design HBM2E Implementation on 12LP/12LP+
GlobalFoundries and SiFive announced on Tuesday that they will be co-developing an implementation of HBM2E memory for GloFo's 12LP and 12LP+ FinFET process technologies. The IP package will enable...
13 by Anton Shilov on 11/5/2019
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